About: Stability of Microstructure of UFG Copper after Fatigue Loading and Thermal Exposition     Goto   Sponge   NotDistinct   Permalink

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  • The objective of the present work was to study the stability of microstructure of ultra fine-grained (UFG) copper under high-cycle and very high-cycle fatigue loading and under thermal exposition. UFG Cu was prepared by equal channel angular pressing. No grain coarsening was observed after fatigue resulting in failure in the interval from 104 to 1010 cycles. Similarly, no grain coarsening was detected after thermal exposition at a temperature of 180 C for 6 min. The microstructure was examined by electron backscattering diffraction (EBSD) and transmission electron microscopy (TEM)
  • The objective of the present work was to study the stability of microstructure of ultra fine-grained (UFG) copper under high-cycle and very high-cycle fatigue loading and under thermal exposition. UFG Cu was prepared by equal channel angular pressing. No grain coarsening was observed after fatigue resulting in failure in the interval from 104 to 1010 cycles. Similarly, no grain coarsening was detected after thermal exposition at a temperature of 180 C for 6 min. The microstructure was examined by electron backscattering diffraction (EBSD) and transmission electron microscopy (TEM) (en)
Title
  • Stability of Microstructure of UFG Copper after Fatigue Loading and Thermal Exposition
  • Stability of Microstructure of UFG Copper after Fatigue Loading and Thermal Exposition (en)
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  • Stability of Microstructure of UFG Copper after Fatigue Loading and Thermal Exposition
  • Stability of Microstructure of UFG Copper after Fatigue Loading and Thermal Exposition (en)
skos:notation
  • RIV/00216305:26210/09:PU81426!RIV10-MSM-26210___
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  • P(2E08017)
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  • 343320
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  • RIV/00216305:26210/09:PU81426
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  • UFG copper, ECAP, stability of microstructure, EBSD (en)
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  • [4600B13A0BAE]
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  • Žilina
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  • Žilina, Sk
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  • Proceedings Transcom 2009
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  • Kunz, Ludvík
  • Navrátilová, Lucie
  • Pantělejev, Libor
  • Man, Ondřej
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  • Žilinská univerzita v Žiline
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  • 978-80-554-0042-6
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  • 26210
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