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rdf:type
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Description
| - Metal nanoparticles are considered as potential candidates for use as solder materials for high temperature applications. It is known that physical, electronic, and thermodynamic properties of nano-objects are significantly different from those of the bulk materials because of the effect of decrease of melting point of small particles below the melting point of the bulk material. Exploiting this effect, the substantial depression of melting temperature of lead-free solders could be reached, sparing energy, expenses, being friendly to the environment at the same time. One the other hand the main problem of lead-free solder materials is surface oxidation or reactions which decrease for example the wettability of the solder. As the volume ratio of the metal in oxide layer increases with decreasing particle radius the materials have to be protected.
- Metal nanoparticles are considered as potential candidates for use as solder materials for high temperature applications. It is known that physical, electronic, and thermodynamic properties of nano-objects are significantly different from those of the bulk materials because of the effect of decrease of melting point of small particles below the melting point of the bulk material. Exploiting this effect, the substantial depression of melting temperature of lead-free solders could be reached, sparing energy, expenses, being friendly to the environment at the same time. One the other hand the main problem of lead-free solder materials is surface oxidation or reactions which decrease for example the wettability of the solder. As the volume ratio of the metal in oxide layer increases with decreasing particle radius the materials have to be protected. (en)
- Metal nanoparticles are considered as potential candidates for use as solder materials for high temperature applications. It is known that physical, electronic, and thermodynamic properties of nano-objects are significantly different from those of the bulk materials because of the effect of decrease of melting point of small particles below the melting point of the bulk material. Exploiting this effect, the substantial depression of melting temperature of lead-free solders could be reached, sparing energy, expenses, being friendly to the environment at the same time. One the other hand the main problem of lead-free solder materials is surface oxidation or reactions which decrease for example the wettability of the solder. As the volume ratio of the metal in oxide layer increases with decreasing particle radius the materials have to be protected. (cs)
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Title
| - On the stability of Ag, Cu, and Sn nanoparticles
- On the stability of Ag, Cu, and Sn nanoparticles (en)
- On the stability of Ag, Cu, and Sn nanoparticles (cs)
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skos:prefLabel
| - On the stability of Ag, Cu, and Sn nanoparticles
- On the stability of Ag, Cu, and Sn nanoparticles (en)
- On the stability of Ag, Cu, and Sn nanoparticles (cs)
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skos:notation
| - RIV/00216224:14310/09:00049590!RIV12-GA0-14310___
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http://linked.open...avai/riv/aktivita
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http://linked.open...avai/riv/aktivity
| - P(GA106/09/0700), P(OC09010), S
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http://linked.open...vai/riv/dodaniDat
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http://linked.open...aciTvurceVysledku
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http://linked.open.../riv/druhVysledku
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http://linked.open...iv/duvernostUdaju
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http://linked.open...titaPredkladatele
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http://linked.open...dnocenehoVysledku
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http://linked.open...ai/riv/idVysledku
| - RIV/00216224:14310/09:00049590
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http://linked.open...riv/jazykVysledku
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http://linked.open.../riv/klicovaSlova
| - CALPHAD; thermal analysis; nano; phase diagram (en)
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http://linked.open.../riv/klicoveSlovo
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http://linked.open...ontrolniKodProRIV
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http://linked.open...in/vavai/riv/obor
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http://linked.open...ichTvurcuVysledku
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http://linked.open...cetTvurcuVysledku
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http://linked.open...vavai/riv/projekt
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http://linked.open...UplatneniVysledku
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http://linked.open...iv/tvurceVysledku
| - Brož, Pavel
- Sopoušek, Jiří
- Vřešťál, Jan
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http://localhost/t...ganizacniJednotka
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