About: Microstructure Changes and Physical Properties of the Intermetallic Compounds Formed at the Interface     Goto   Sponge   NotDistinct   Permalink

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Description
  • Microstructure changes at the interface between Sn-Cu solders and Cu substrate cause by minor additions of Ni as well as the physical properties of intermetallic compound formed at this interface were investigated using light and scanning electron microscopy.
  • Microstructure changes at the interface between Sn-Cu solders and Cu substrate cause by minor additions of Ni as well as the physical properties of intermetallic compound formed at this interface were investigated using light and scanning electron microscopy. (en)
Title
  • Microstructure Changes and Physical Properties of the Intermetallic Compounds Formed at the Interface
  • Microstructure Changes and Physical Properties of the Intermetallic Compounds Formed at the Interface (en)
skos:prefLabel
  • Microstructure Changes and Physical Properties of the Intermetallic Compounds Formed at the Interface
  • Microstructure Changes and Physical Properties of the Intermetallic Compounds Formed at the Interface (en)
skos:notation
  • RIV/00216208:11320/10:10062221!RIV11-MSM-11320___
http://linked.open...avai/riv/aktivita
http://linked.open...avai/riv/aktivity
  • P(1M0556), S
http://linked.open...iv/cisloPeriodika
  • 12
http://linked.open...vai/riv/dodaniDat
http://linked.open...aciTvurceVysledku
http://linked.open.../riv/druhVysledku
http://linked.open...iv/duvernostUdaju
http://linked.open...titaPredkladatele
http://linked.open...dnocenehoVysledku
  • 271274
http://linked.open...ai/riv/idVysledku
  • RIV/00216208:11320/10:10062221
http://linked.open...riv/jazykVysledku
http://linked.open.../riv/klicovaSlova
  • Interface; the; Formed; Compounds; Intermetallic; the; Properties; Physical; and; Changes; Microstructure (en)
http://linked.open.../riv/klicoveSlovo
http://linked.open...odStatuVydavatele
  • US - Spojené státy americké
http://linked.open...ontrolniKodProRIV
  • [309A29E8C8F5]
http://linked.open...i/riv/nazevZdroje
  • Journal of Electronic Materials
http://linked.open...in/vavai/riv/obor
http://linked.open...ichTvurcuVysledku
http://linked.open...cetTvurcuVysledku
http://linked.open...vavai/riv/projekt
http://linked.open...UplatneniVysledku
http://linked.open...v/svazekPeriodika
  • 39
http://linked.open...iv/tvurceVysledku
  • Janeček, Miloš
  • Harcuba, Petr
http://linked.open...ain/vavai/riv/wos
  • 000283509000008
issn
  • 0361-5235
number of pages
http://localhost/t...ganizacniJednotka
  • 11320
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