About: The Effect of Cu and Ni on the structure and properties of the IMC formed by the reaction of liquid Sn-Cu based solders with Cu substrate     Goto   Sponge   NotDistinct   Permalink

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  • The effect of Cu and Ni alloying elements on the morphology of the intermetallic compounds formed at the interface of the liquid Sn-Cu solder and the Cu substrate has been studied. At low Cu concentrations only a thin IMC layer is formed which remains almost unchanged in time and the substrate is dissolving quickly. Ni additions significantly accelerate the growth kinetics of the IMC layer, prevent the formation of a Cu3Sn layer and reduce the rate of substrate dissolution.
  • The effect of Cu and Ni alloying elements on the morphology of the intermetallic compounds formed at the interface of the liquid Sn-Cu solder and the Cu substrate has been studied. At low Cu concentrations only a thin IMC layer is formed which remains almost unchanged in time and the substrate is dissolving quickly. Ni additions significantly accelerate the growth kinetics of the IMC layer, prevent the formation of a Cu3Sn layer and reduce the rate of substrate dissolution. (en)
Title
  • The Effect of Cu and Ni on the structure and properties of the IMC formed by the reaction of liquid Sn-Cu based solders with Cu substrate
  • The Effect of Cu and Ni on the structure and properties of the IMC formed by the reaction of liquid Sn-Cu based solders with Cu substrate (en)
skos:prefLabel
  • The Effect of Cu and Ni on the structure and properties of the IMC formed by the reaction of liquid Sn-Cu based solders with Cu substrate
  • The Effect of Cu and Ni on the structure and properties of the IMC formed by the reaction of liquid Sn-Cu based solders with Cu substrate (en)
skos:notation
  • RIV/00216208:11320/09:00206338!RIV10-MSM-11320___
http://linked.open...avai/riv/aktivita
http://linked.open...avai/riv/aktivity
  • P(1M0556)
http://linked.open...iv/cisloPeriodika
  • -
http://linked.open...vai/riv/dodaniDat
http://linked.open...aciTvurceVysledku
http://linked.open.../riv/druhVysledku
http://linked.open...iv/duvernostUdaju
http://linked.open...titaPredkladatele
http://linked.open...dnocenehoVysledku
  • 312044
http://linked.open...ai/riv/idVysledku
  • RIV/00216208:11320/09:00206338
http://linked.open...riv/jazykVysledku
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  • Effect; structure; properties; formed; reaction; liquid; Sn-Cu; based; solders; substrate (en)
http://linked.open.../riv/klicoveSlovo
http://linked.open...odStatuVydavatele
  • SK - Slovenská republika
http://linked.open...ontrolniKodProRIV
  • [416D5CB1837C]
http://linked.open...i/riv/nazevZdroje
  • Kovové materiály
http://linked.open...in/vavai/riv/obor
http://linked.open...ichTvurcuVysledku
http://linked.open...cetTvurcuVysledku
http://linked.open...vavai/riv/projekt
http://linked.open...UplatneniVysledku
http://linked.open...v/svazekPeriodika
  • 47
http://linked.open...iv/tvurceVysledku
  • Janeček, Miloš
  • Harcuba, Petr
  • Slámová, M.
http://linked.open...ain/vavai/riv/wos
  • 000267933100004
issn
  • 0023-432X
number of pages
http://localhost/t...ganizacniJednotka
  • 11320
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