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  • The creep behavior of high purity aluminum and copper, Al-0.2wt.%Sc and Cu- 0.2wt.%Zr alloys was examined after processing by equal-channel angular pressing (ECAP) with an emphasis on the link between microstructure and creep. The microstructure was revealed by electron backscatter diffraction (EBSD) and analyzed by stereological methods. Representative microstructural parameters were obtained using orientation imaging microscopy and EBSD on the relationship between creep behavior and microstructure.
  • The creep behavior of high purity aluminum and copper, Al-0.2wt.%Sc and Cu- 0.2wt.%Zr alloys was examined after processing by equal-channel angular pressing (ECAP) with an emphasis on the link between microstructure and creep. The microstructure was revealed by electron backscatter diffraction (EBSD) and analyzed by stereological methods. Representative microstructural parameters were obtained using orientation imaging microscopy and EBSD on the relationship between creep behavior and microstructure. (en)
Title
  • Microstructure evolution and creep behavior in ECAP processed metallic materials
  • Microstructure evolution and creep behavior in ECAP processed metallic materials (en)
skos:prefLabel
  • Microstructure evolution and creep behavior in ECAP processed metallic materials
  • Microstructure evolution and creep behavior in ECAP processed metallic materials (en)
skos:notation
  • RIV/68081723:_____/14:00435501!RIV15-GA0-68081723
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  • I, P(ED1.1.00/02.0068), P(GAP108/11/2260)
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  • 29262
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  • RIV/68081723:_____/14:00435501
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  • Equal-channel angular pressing (ECAP); Creep; Ultrafine-grained materials; Orientation imaging microscopy; Structure homogeneity; Nanoporosity (en)
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  • [35B58FEEEC0E]
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  • Las Vegas
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  • Zurich
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  • THERMEC 2013
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  • Dvořák, Jiří
  • Král, Petr
  • Kvapilová, Marie
  • Sklenička, Václav
  • Svoboda, Milan
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issn
  • 0255-5476
number of pages
http://bibframe.org/vocab/doi
  • 10.4028/www.scientific.net/MSF.783-786.2689
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  • Trans Tech Publications
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  • 978-3-03835-073-6
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