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  • This article presents results of research aimed at the influence of manufacturing process of electronic device on creation and growth of intermetallic layers in the solder. These layers can significantly influence performance and reliability of the entire electronic device. Exact beahvior of intermetallic compounds under various conditions is not yet fully known - that is also one of the reasons sensitive devices for aerospace, medical or military industries are allowed to still use solders containing lead - and it is important to gain such knowledge, before the leadfree solders are allowed into such applications. To further this goal, this research compared both experimentally and theoretically various situations, that may be encountered during the electronic devices production.
  • This article presents results of research aimed at the influence of manufacturing process of electronic device on creation and growth of intermetallic layers in the solder. These layers can significantly influence performance and reliability of the entire electronic device. Exact beahvior of intermetallic compounds under various conditions is not yet fully known - that is also one of the reasons sensitive devices for aerospace, medical or military industries are allowed to still use solders containing lead - and it is important to gain such knowledge, before the leadfree solders are allowed into such applications. To further this goal, this research compared both experimentally and theoretically various situations, that may be encountered during the electronic devices production. (en)
Title
  • Influence of Reflow Temperature Profile on Properties of Soldered Joints
  • Influence of Reflow Temperature Profile on Properties of Soldered Joints (en)
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  • Influence of Reflow Temperature Profile on Properties of Soldered Joints
  • Influence of Reflow Temperature Profile on Properties of Soldered Joints (en)
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  • RIV/68407700:21230/09:00162950!RIV10-MSM-21230___
http://linked.open...avai/riv/aktivita
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  • Z(MSM6840770021)
http://linked.open...vai/riv/dodaniDat
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  • 319328
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  • RIV/68407700:21230/09:00162950
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  • soldering; leadfree; temperature profile (en)
http://linked.open.../riv/klicoveSlovo
http://linked.open...ontrolniKodProRIV
  • [415818BD4A21]
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  • Brno
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  • Brno
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  • Electronic Devices and Systems, IMAPS CS International Conference 2009 Proceedings
http://linked.open...in/vavai/riv/obor
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  • Tučan, Marek
  • Urbánek, Jan
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http://linked.open...n/vavai/riv/zamer
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  • Vysoké učení technické v Brně. Fakulta elektrotechniky a informatiky
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  • 978-80-214-3933-7
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  • 21230
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