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Description
| - U bezolovnatých pájek došlo ke změně některých parametrů, mezi něž patří i smáčivost. Tento článek se zabývá problematikou měření smáčivosti a expirementy. (cs)
- Lead free soldering implementation process needs some knowledge’s about behavior of lead-free materials where fundamental seems to be wettability. Without good wettability the process performance can’t be convenient technical and economical too. Material selection for soldering process has to be compatible for having the best results in wetting characteristics, which are important for solder joint formation, and for final solder joint reliability. This includes optimal selection of fluxes, air/nitrogen atmosphere, solders alloy compositions, surface treatments of components and PCBs and other factors. This paper presents some facts from this area.
- Lead free soldering implementation process needs some knowledge’s about behavior of lead-free materials where fundamental seems to be wettability. Without good wettability the process performance can’t be convenient technical and economical too. Material selection for soldering process has to be compatible for having the best results in wetting characteristics, which are important for solder joint formation, and for final solder joint reliability. This includes optimal selection of fluxes, air/nitrogen atmosphere, solders alloy compositions, surface treatments of components and PCBs and other factors. This paper presents some facts from this area. (en)
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Title
| - Smáčivost pro olovnaté a bezolovnaté pájky (cs)
- Wettability – SnPb and Lead-free
- Wettability – SnPb and Lead-free (en)
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skos:prefLabel
| - Smáčivost pro olovnaté a bezolovnaté pájky (cs)
- Wettability – SnPb and Lead-free
- Wettability – SnPb and Lead-free (en)
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skos:notation
| - RIV/00216305:26220/04:PU44041!RIV/2005/GA0/262205/N
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http://linked.open.../vavai/riv/strany
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http://linked.open...avai/riv/aktivita
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http://linked.open...avai/riv/aktivity
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http://linked.open...vai/riv/dodaniDat
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http://linked.open...aciTvurceVysledku
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http://linked.open.../riv/druhVysledku
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http://linked.open...iv/duvernostUdaju
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http://linked.open...titaPredkladatele
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http://linked.open...dnocenehoVysledku
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http://linked.open...ai/riv/idVysledku
| - RIV/00216305:26220/04:PU44041
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http://linked.open...riv/jazykVysledku
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http://linked.open.../riv/klicovaSlova
| - lead free soldering, wettability (en)
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http://linked.open.../riv/klicoveSlovo
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http://linked.open...ontrolniKodProRIV
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http://linked.open...v/mistoKonaniAkce
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http://linked.open...i/riv/mistoVydani
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http://linked.open...i/riv/nazevZdroje
| - 11th Electronic Devices and Systems Conference 2004 Proceedings
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http://linked.open...in/vavai/riv/obor
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http://linked.open...ichTvurcuVysledku
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http://linked.open...cetTvurcuVysledku
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http://linked.open...vavai/riv/projekt
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http://linked.open...UplatneniVysledku
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http://linked.open...iv/tvurceVysledku
| - Szendiuch, Ivan
- Bulva, Jindřich
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http://linked.open...vavai/riv/typAkce
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http://linked.open.../riv/zahajeniAkce
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number of pages
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http://purl.org/ne...btex#hasPublisher
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https://schema.org/isbn
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http://localhost/t...ganizacniJednotka
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