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Description
  • Monitoring of the solder spread is one of the tools which should be used to solderability and wetability quantification. In this paper we focus on the different solder spread in correlation with different surface finishes of the PCB and different type of reflow process. In our experiment we used three types of solder pastes (one lead Sn62Pb32Ag2 and two lead free Sn95,5Ag4Cu0,5, Sn99,25Cu0,7Ni0,05 solders) and four types of surface finishes of PCB
  • Monitoring of the solder spread is one of the tools which should be used to solderability and wetability quantification. In this paper we focus on the different solder spread in correlation with different surface finishes of the PCB and different type of reflow process. In our experiment we used three types of solder pastes (one lead Sn62Pb32Ag2 and two lead free Sn95,5Ag4Cu0,5, Sn99,25Cu0,7Ni0,05 solders) and four types of surface finishes of PCB (en)
Title
  • Influence of different surface finishes of PCB on the solder spread
  • Influence of different surface finishes of PCB on the solder spread (en)
skos:prefLabel
  • Influence of different surface finishes of PCB on the solder spread
  • Influence of different surface finishes of PCB on the solder spread (en)
skos:notation
  • RIV/68407700:21230/11:00185875!RIV12-MSM-21230___
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http://linked.open...avai/riv/aktivita
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  • Z(MSM0021620834), Z(MSM6840770021)
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  • 204384
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  • RIV/68407700:21230/11:00185875
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  • Solder spread, surface finishes, PCB (en)
http://linked.open.../riv/klicoveSlovo
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  • [89EA6C6018BA]
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  • Tatranská Lomnica
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  • Košice
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  • 34th International Spring Seminar on Electronics Technology
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  • Dušek, Karel
  • Novák, Michal
  • Rudajevová, A.
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http://linked.open.../riv/zahajeniAkce
http://linked.open...n/vavai/riv/zamer
number of pages
http://bibframe.org/vocab/doi
  • 10.1109/ISSE.2011.6053576
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  • Technická univerzita v Košiciach
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  • 978-1-4577-2111-3
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  • 21230
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