About: Investigation of IMC Growth in Solder Joints

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rdf:type	skos:Concept http://linked.opendata.cz/ontology/domain/vavai/Vysledek
Description	This article deals with intermetallic layers which occure at the interface between solder and soldered material. To eliminate hazardous materials, only lead-free alloys, excluding special exemptions, are used today, not only in the Europe Union. Therefore, observing of creation of intermetallic compound between various lead-free soldering alloys and basic material is subject of wide interest. Many factors affect creating of intermetallic compounds, for example soldering temperature, constitution of solder, or setting of technological process of soldering. It depends, for example, on whether the solder joint is soldering by reflow oven, manually, by vapour phase soldering, or by dipping. Research of intermetallic compound growth in context of different soldering process setting, constitution of solder and artificial aging by raising thermal stress are presented in this article. The samples were divided into several groups to make comparison possible. One of these groups was leaved in room atmosphere an This article deals with intermetallic layers which occure at the interface between solder and soldered material. To eliminate hazardous materials, only lead-free alloys, excluding special exemptions, are used today, not only in the Europe Union. Therefore, observing of creation of intermetallic compound between various lead-free soldering alloys and basic material is subject of wide interest. Many factors affect creating of intermetallic compounds, for example soldering temperature, constitution of solder, or setting of technological process of soldering. It depends, for example, on whether the solder joint is soldering by reflow oven, manually, by vapour phase soldering, or by dipping. Research of intermetallic compound growth in context of different soldering process setting, constitution of solder and artificial aging by raising thermal stress are presented in this article. The samples were divided into several groups to make comparison possible. One of these groups was leaved in room atmosphere an (en) This article deals with intermetallic layers which occure at the interface between solder and soldered material. To eliminate hazardous materials, only lead-free alloys, excluding special exemptions, are used today, not only in the Europe Union. Therefore, observing of creation of intermetallic compound between various lead-free soldering alloys and basic material is subject of wide interest. Many factors affect creating of intermetallic compounds, for example soldering temperature, constitution of solder, or setting of technological process of soldering. It depends, for example, on whether the solder joint is soldering by reflow oven, manually, by vapour phase soldering, or by dipping. Research of intermetallic compound growth in context of different soldering process setting, constitution of solder and artificial aging by raising thermal stress are presented in this article. The samples were divided into several groups to make comparison possible. One of these groups was leaved in room atmosphere an (cs)
Title	Investigation of IMC Growth in Solder Joints (en) Zkoumání růstu IMC v pájeném spoji Zkoumání růstu IMC v pájeném spoji (cs)
skos:prefLabel	Investigation of IMC Growth in Solder Joints (en) Zkoumání růstu IMC v pájeném spoji Zkoumání růstu IMC v pájeném spoji (cs)
skos:notation	RIV/49777513:23220/10:00503933!RIV11-MSM-23220___
http://linked.open...avai/riv/aktivita	S
http://linked.open...avai/riv/aktivity	S
http://linked.open...vai/riv/dodaniDat	2011
http://linked.open...aciTvurceVysledku	Novák, Tomáš
http://linked.open.../riv/druhVysledku	O - Ostatní výsledky nezařaditelné do žádného z výše uvedených druhů výsledku
http://linked.open...iv/duvernostUdaju	S - Úplné a pravdivé údaje nepodléhající ochraně podle zvláštních právních předpisů
http://linked.open...titaPredkladatele	Západočeská univerzita v Plzni / Fakulta elektrotechnická
http://linked.open...dnocenehoVysledku	300076
http://linked.open...ai/riv/idVysledku	RIV/49777513:23220/10:00503933
http://linked.open...riv/jazykVysledku	cze - čeština
http://linked.open.../riv/klicovaSlova	Intermetallic compounds; lead-free solder; copper substrate; thermal aging (en)
http://linked.open.../riv/klicoveSlovo	thermal aging lead-free solder Intermetallic compounds copper substrate
http://linked.open...ontrolniKodProRIV	[D67552248503]
http://linked.open...in/vavai/riv/obor	JA
http://linked.open...ichTvurcuVysledku	1 (xsd:int)
http://linked.open...cetTvurcuVysledku	1 (xsd:int)
http://linked.open...UplatneniVysledku	2010
http://linked.open...iv/tvurceVysledku	Novák, Tomáš
http://localhost/t...ganizacniJednotka	23220

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