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About:
On the Application of Solder Balls for 3D Packaging
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An Entity of Type :
http://linked.opendata.cz/ontology/domain/vavai/Vysledek
, within Data Space :
linked.opendata.cz
associated with source
document(s)
Type:
skos:Concept
http://linked.opendata.cz/ontology/domain/vavai/Vysledek
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rdf:type
skos:Concept
http://linked.opendata.cz/ontology/domain/vavai/Vysledek
Description
Deals with the Application of Solder Balls for 3D Packaging and modern electronic system configurations
Deals with the Application of Solder Balls for 3D Packaging and modern electronic system configurations
(en)
Title
On the Application of Solder Balls for 3D Packaging
On the Application of Solder Balls for 3D Packaging
(en)
skos:prefLabel
On the Application of Solder Balls for 3D Packaging
On the Application of Solder Balls for 3D Packaging
(en)
skos:notation
RIV/00216305:26220/10:PU88231!RIV11-GA0-26220___
http://linked.open...avai/riv/aktivita
P
S
Z
http://linked.open...avai/riv/aktivity
P(GA102/09/1701), S, Z(MSM0021630503)
http://linked.open...iv/cisloPeriodika
8
http://linked.open...vai/riv/dodaniDat
2011
http://linked.open...aciTvurceVysledku
Szendiuch, Ivan
Nicák, Michal
http://linked.open.../riv/druhVysledku
J - Článek v odborném periodiku
http://linked.open...iv/duvernostUdaju
S - Úplné a pravdivé údaje nepodléhající ochraně podle zvláštních právních předpisů
http://linked.open...titaPredkladatele
Vysoké učení technické v Brně / Fakulta elektrotechniky a komunikačních technologií
http://linked.open...dnocenehoVysledku
276822
http://linked.open...ai/riv/idVysledku
RIV/00216305:26220/10:PU88231
http://linked.open...riv/jazykVysledku
eng - angličtina
http://linked.open.../riv/klicovaSlova
solder ball, soldering, 3D configuration, 3D packaging
(en)
http://linked.open.../riv/klicoveSlovo
3D packaging
soldering
solder ball
3D configuration
http://linked.open...odStatuVydavatele
DE - Spolková republika Německo
http://linked.open...ontrolniKodProRIV
[BD64AC35DFED]
http://linked.open...i/riv/nazevZdroje
PLUS
http://linked.open...in/vavai/riv/obor
JA
http://linked.open...ichTvurcuVysledku
2
(
xsd:int
)
http://linked.open...cetTvurcuVysledku
2
(
xsd:int
)
http://linked.open...vavai/riv/projekt
Research and Development of the New Soldering Principles for Increasing of Solder Joints Reliability
http://linked.open...UplatneniVysledku
2010
http://linked.open...v/svazekPeriodika
2010
http://linked.open...iv/tvurceVysledku
Szendiuch, Ivan
Nicák, Michal
http://linked.open...n/vavai/riv/zamer
Nové trendy v mikroelektronických systémech a nanotechnologiích (MIKROSYN)
issn
1436-7505
number of pages
6
(
xsd:int
)
http://localhost/t...ganizacniJednotka
26220
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