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rdf:type
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Description
| - Implementace procesu bezolovnatého pájení vyžaduje znalosti o materiálové a procesní kompatibilitě jednotlivých složek v procesu. Materiálová kompatibilita zahrnuje volbu povrchové úpravy, tavidla i pájky. Procesní - zahrnuje režim přetavení. Pro sledování kompatibility byly voleny i rozdílné řízené atmosféry a porovnávány se vzduchem. (cs)
- Lead free soldering implementation process needs some knowledges about materials and process compatibility in different industrial conditions. Material selection for soldering process has to be compatible for having the best results in wetting characteristics, solder joint formation, and final solder joint reliability. Material compatibility includes selection type of fluxes, soldering atmosphere, solder alloy composition, surface treatments of components and PCBs and optimized soldering process settinggs. Nitrogen, nitrogen/hydrogen atmospheres have to improve solder process yield effect. These experiments are focused on wetting phenomena and describes/analyses wettability and spreadability of surfaces with different chemistry in soldering processes. Two method were used:
- Lead free soldering implementation process needs some knowledges about materials and process compatibility in different industrial conditions. Material selection for soldering process has to be compatible for having the best results in wetting characteristics, solder joint formation, and final solder joint reliability. Material compatibility includes selection type of fluxes, soldering atmosphere, solder alloy composition, surface treatments of components and PCBs and optimized soldering process settinggs. Nitrogen, nitrogen/hydrogen atmospheres have to improve solder process yield effect. These experiments are focused on wetting phenomena and describes/analyses wettability and spreadability of surfaces with different chemistry in soldering processes. Two method were used: (en)
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Title
| - Studium smáčecích charakteristik v pájecím procesu v dusíkové, dusíko-vodíkové atmosféře a porovnání se vzduchem (cs)
- Wetting characteristics Study of Soldering Process in Nitrogen and Nitrogen / Hydrogen Atmosphere
- Wetting characteristics Study of Soldering Process in Nitrogen and Nitrogen / Hydrogen Atmosphere (en)
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skos:prefLabel
| - Studium smáčecích charakteristik v pájecím procesu v dusíkové, dusíko-vodíkové atmosféře a porovnání se vzduchem (cs)
- Wetting characteristics Study of Soldering Process in Nitrogen and Nitrogen / Hydrogen Atmosphere
- Wetting characteristics Study of Soldering Process in Nitrogen and Nitrogen / Hydrogen Atmosphere (en)
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skos:notation
| - RIV/00216305:26220/04:PU45763!RIV/2005/MSM/262205/N
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http://linked.open.../vavai/riv/strany
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http://linked.open...avai/riv/aktivita
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http://linked.open...avai/riv/aktivity
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http://linked.open...vai/riv/dodaniDat
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http://linked.open...aciTvurceVysledku
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http://linked.open.../riv/druhVysledku
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http://linked.open...iv/duvernostUdaju
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http://linked.open...titaPredkladatele
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http://linked.open...dnocenehoVysledku
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http://linked.open...ai/riv/idVysledku
| - RIV/00216305:26220/04:PU45763
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http://linked.open...riv/jazykVysledku
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http://linked.open.../riv/klicovaSlova
| - lead free, solderability, wettability, surface finish, flux, nitrogen, forming gas (en)
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http://linked.open.../riv/klicoveSlovo
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http://linked.open...ontrolniKodProRIV
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http://linked.open...v/mistoKonaniAkce
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http://linked.open...i/riv/mistoVydani
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http://linked.open...i/riv/nazevZdroje
| - 3rd European Microelectronics and Packaging Symposium
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http://linked.open...in/vavai/riv/obor
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http://linked.open...ichTvurcuVysledku
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http://linked.open...cetTvurcuVysledku
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http://linked.open...UplatneniVysledku
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http://linked.open...iv/tvurceVysledku
| - Starý, Jiří
- Kazelle, Jiří
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http://linked.open...vavai/riv/typAkce
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http://linked.open.../riv/zahajeniAkce
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http://linked.open...n/vavai/riv/zamer
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number of pages
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http://purl.org/ne...btex#hasPublisher
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https://schema.org/isbn
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http://localhost/t...ganizacniJednotka
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