About: Spectroscopic elipsometry and ellipsometric porosimetry studies of CVD low-k dielectric films

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rdf:type	skos:Concept http://linked.opendata.cz/ontology/domain/vavai/Vysledek
Description	Aurora ELK, a porous low-k SiCOH film deposited by CVD, was used to study the effect of UV curing. Samples were cured for various curing times and the purpose of this work is to observe the effects of UV curing on optical, mechanical and structural properties of the low-k film. We have used 1) ellipsometric porosimetry to determine the porosity and the pore-size distribution and 2) nitrogen purged UV ellipsometry in a range from 2 to 9 eV to observe the changes of the di-electric function of the cured material. Additional FTIR and laser-induced surface acoustic wave measurements were performed. The porogen removal and the increase of porosity were observed, and a k-value of 2.3 was reached for the optimum curing time. However for longer curing times, densification and reduction of the porosity occurs. The growth of the hydrogen incorporation has been observed. Aurora ELK, a porous low-k SiCOH film deposited by CVD, was used to study the effect of UV curing. Samples were cured for various curing times and the purpose of this work is to observe the effects of UV curing on optical, mechanical and structural properties of the low-k film. We have used 1) ellipsometric porosimetry to determine the porosity and the pore-size distribution and 2) nitrogen purged UV ellipsometry in a range from 2 to 9 eV to observe the changes of the di-electric function of the cured material. Additional FTIR and laser-induced surface acoustic wave measurements were performed. The porogen removal and the increase of porosity were observed, and a k-value of 2.3 was reached for the optimum curing time. However for longer curing times, densification and reduction of the porosity occurs. The growth of the hydrogen incorporation has been observed. (en)
Title	Spectroscopic elipsometry and ellipsometric porosimetry studies of CVD low-k dielectric films Spectroscopic elipsometry and ellipsometric porosimetry studies of CVD low-k dielectric films (en)
skos:prefLabel	Spectroscopic elipsometry and ellipsometric porosimetry studies of CVD low-k dielectric films Spectroscopic elipsometry and ellipsometric porosimetry studies of CVD low-k dielectric films (en)
skos:notation	RIV/00216224:14310/08:00026014!RIV10-MSM-14310___
http://linked.open...avai/riv/aktivita	Z
http://linked.open...avai/riv/aktivity	Z(MSM0021622410)
http://linked.open...iv/cisloPeriodika	5
http://linked.open...vai/riv/dodaniDat	2010
http://linked.open...aciTvurceVysledku	Maršík, Přemysl
http://linked.open.../riv/druhVysledku	J - Článek v odborném periodiku
http://linked.open...iv/duvernostUdaju	S - Úplné a pravdivé údaje nepodléhající ochraně podle zvláštních právních předpisů
http://linked.open...titaPredkladatele	Masarykova univerzita / Přírodovědecká fakulta
http://linked.open...dnocenehoVysledku	396461
http://linked.open...ai/riv/idVysledku	RIV/00216224:14310/08:00026014
http://linked.open...riv/jazykVysledku	eng - angličtina
http://linked.open.../riv/klicovaSlova	low-k dielectrics; ellipsometry; porosimetry (en)
http://linked.open.../riv/klicoveSlovo	ellipsometry porosimetry low-k dielectrics
http://linked.open...odStatuVydavatele	BE - Belgické království
http://linked.open...ontrolniKodProRIV	[4E67F9001D75]
http://linked.open...i/riv/nazevZdroje	physica status solidi (c)
http://linked.open...in/vavai/riv/obor	BM
http://linked.open...ichTvurcuVysledku	1 (xsd:int)
http://linked.open...cetTvurcuVysledku	6 (xsd:int)
http://linked.open...UplatneniVysledku	2008
http://linked.open...v/svazekPeriodika	5
http://linked.open...iv/tvurceVysledku	Maršík, Přemysl Baklanov, Mikhail De Roest, David Schneider, Dieter Verdonck, Patrick Kaneko, Shinya
http://linked.open...ain/vavai/riv/wos	000256862500061
http://linked.open...n/vavai/riv/zamer	Physical and chemical properties of advanced materials and structures
issn	1610-1634
number of pages	4 (xsd:int)
http://localhost/t...ganizacniJednotka	14310

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